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URL: https://www.horiba.com/en_en/products/detail/action/show/Product/gr-300-series-713/
Proper Citation: Horiba GR-300 Series Wafer Back Side Cooling System (RRID:SCR_020075)
Description: Can control gases used to cool back side of wafers that are fixed in position by electrostatic chuck system.
Resource Type: instrument resource
Keywords: Horiba, Wafer Back Side Cooling System, Instrument, Resource Equipment, Equipment, USEDit,
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